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1.
VELO Module Production - Back End Bonding / Whitley, M ; Wormald, M
This note describes in detail the procedures used in the bonding of the ASICs (Beetle 1.5 chips) to the hybrid for the LHCb VELO detector modules..
LHCb-2007-078; CERN-LHCb-2007-078.- Geneva : CERN, 2007 - 19 p. Access to fulltext document: PDF;
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