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CERN Accelerating science

RD50 Conference Proceedings

最近の追加:
2021-01-22
04:13
Pixelated 3D sensors for tracking in radiation harsh environments / Duarte-Campderros, Jordi (Cantabria Inst. of Phys.)
The High Luminosity upgrade of the CERN Large Hadron Collider will be able to reach a peak instantaneous luminosity of 5E34/cm2 s. [...]
arXiv:2101.06019.
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Fulltext

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2020-12-16
06:02
LGAD and 3D as Timing Detectors / Ugobono, Sofia Otero (Barcelona, Inst. Microelectron.) /RD50 Collaboration
In view of the High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC), radiation tolerant silicon sensors are being developed in the framework of ATLAS, CMS, RD50 and other sensor R\&D; projects. The HL-LHC beam parameters and hardware configuration should enable the collider to reach a peak instantaneous luminosity of $5\times10^{34}\textrm{ cm}^{-2}\textrm{s}^{-1}$, and an integrated luminosity of 250 fb$^{-1}/\textrm{year}$ with the goal of 3000 fb$^{-1}$ after about 12 years of operation. [...]
SISSA, 2019 - 13 p. - Published in : PoS Vertex2019 (2019) 035 Fulltext from Publisher: PDF;
In : Vertex 2019: 28th International Workshop on Vertex Detectors, Lopud Island, Croatia, 13 - 18 Oct 2019, pp.035

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2020-12-16
06:02
Radiation-tolerant Silicon Detectors for the LHC Phase-II Upgrade and Beyond: Review of RD50 Activities / Ott, Jennifer (Helsinki U. ; Helsinki U. of Tech.) /RD50 Collaboration
At the LHC Phase-II Upgrade foreseen for 2027, the particle densities and radiation levels will increase by roughly an order of magnitude compared to the present LHC conditions, and the silicon-based inner tracking systems have to be able to withstand fluences of up to 2$\times$ 16$^{16}$ n$_{eq}$/cm$^{2}$. To mitigate the increased pileup at the HL-LHC, dedicated timing detectors are employed.Within the CERN RD50 Collaboration, a large RD program has been underway for more than a decade across experimental boundaries to develop silicon sensors with sufficient radiation tolerance for HL-LHC tracking and timing detectors. [...]
SISSA, 2020 - 14 p. - Published in : PoS Vertex2019 (2020) 028 Fulltext from Publisher: PDF;
In : Vertex 2019: 28th International Workshop on Vertex Detectors, Lopud Island, Croatia, 13 - 18 Oct 2019, pp.028

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2020-07-28
06:23
Radiation damage in p-type EPI silicon pad diodes irradiated with protons and neutrons / Gurimskaya, Yana (CERN) ; Dias De Almeida, Pedro (CERN ; Cantabria U., Santander) ; Fernandez Garcia, Marcos (Cantabria U., Santander) ; Mateu Suau, Isidre (CERN) ; Moll, Michael (CERN) ; Fretwurst, Eckhart (Hamburg U.) ; Makarenko, Leonid (Belarus State U.) ; Pintilie, Ioana (Bucharest, Nat. Inst. Mat. Sci.)
In view of the HL-LHC upgrade, radiation-tolerant silicon sensors containing low-resistivity p-type implants or substrates, like LGAD or HV-CMOS devices, are being developed in the framework of ATLAS, CMS, RD50 and other sensor R&D; projects. These devices are facing a particular problem — the apparent deactivation of the doping due to the irradiation, the so-called acceptor removal effect. [...]
Elsevier, 2020 - 4 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 958 (2020) 162221
In : 15th Vienna Conference on Instrumentation, Vienna, Austria, 18 - 22 Feb 2019, pp.162221

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2020-07-25
06:39
Development of RD50-MPW2: a high-speed monolithic HV-CMOS prototype chip within the CERN-RD50 collaboration / Zhang, Chenfan (Liverpool U. ; Fond. Bruno Kessler, Trento) ; Casse, Gianluigi (Liverpool U. ; Fond. Bruno Kessler, Trento) ; Massari, Nicola (Fond. Bruno Kessler, Trento) ; Vilella, Eva (U. Liverpool (main)) ; Vossebeld, Joost (U. Liverpool (main))
The CERN-RD50 collaboration has ongoing research to further develop monolithic High Voltage-CMOS (HV-CMOS) sensors in a 150 nm process for future particle physics experiments. As a part of this research programme, a test chip (RD50-MPW2) that implements new methodologies for low leakage current and fast and low-noise readout circuitry has been designed and submitted for fabrication. [...]
SISSA, 2020 - 5 p. - Published in : PoS TWEPP2019 (2020) 045 Fulltext: PDF;
In : TWEPP 2019 Topical Workshop on Electronics for Particle Physics, Santiago De Compostela, Spain, 2 - 6 Sep 2019, pp.045

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2020-03-19
07:03
Silicon detectors for the LHC Phase-II upgrade and beyond RD50 Status report / Szumlak, T (AGH-UST, Cracow) /RD50
The inner tracking layers of all LHC experiments were designed and developed to cope with the environment of the present Large Hadron Collider (LHC). At the LHC Phase-II Upgrade foreseen for 2026, the particle densities and radiation levels will increase by roughly an order of magnitude compared to the present LHC conditions. [...]
Elsevier, 2020 - 4 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 958 (2020) 162187
In : 15th Vienna Conference on Instrumentation, Vienna, Austria, 18 - 22 Feb 2019, pp.162187

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2019-10-30
04:20
Silicon detectors for the LHC Phase-II upgrade and beyond. RD50 status report / Mandurrino, Marco (CERN)
It is foreseen to significantly increase the luminosity of the LHC in order to harvest the maximum physics potential. [...]
arXiv:1910.06045.
- 2019. - 8 p.
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2019-10-29
06:54
Radiation damage modeling: TCAD simulation / Jain, Geetika (Delhi U.) /RD50 Collaboration
The exceptional performance of the silicon sensors in the radiation environment has led to their extensive application in high energy physics. Even so, the future experiments foresee these sensors to be exposed to higher radiation levels. [...]
SISSA, 2019 - 12 p. - Published in : PoS VERTEX2018 (2019) 017 Fulltext from publisher: PDF;
In : The 27th International Workshop on Vertex Detectors, Chennai, India, 21 - 26 Oct 2018, pp.017

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2018-08-25
06:58
Recent developments of the CERN RD50 collaboration / Menichelli, David (U. Florence (main) ; INFN, Florence) /CERN RD50
The objective of the RD50 collaboration is to develop radiation hard semiconductor detectors for very high luminosity colliders, particularly to face the requirements of the possible upgrade of the large hadron collider (LHC) at CERN. Some of the RD50 most recent results about silicon detectors are reported in this paper, with special reference to: (i) the progresses in the characterization of lattice defects responsible for carrier trapping; (ii) charge collection efficiency of n-in-p microstrip detectors, irradiated with neutrons, as measured with different readout electronics; (iii) charge collection efficiency of single-type column 3D detectors, after proton and neutron irradiations, including position-sensitive measurement; (iv) simulations of irradiated double-sided and full-3D detectors, as well as the state of their production process..
2008 - 5 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 596 (2008) 48-52

In : 8th International Conference on Large Scale Applications and Radiation Hardness of Semiconductor Detectors, Florence, Italy, 27 - 29 Jun 2007, pp.48-52

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2018-08-25
06:58
Development of semiconductor detectors for very harsh radiation environments in high energy physics applications / Casse, G (Liverpool U.) /RD50
The Large Hadron Collider (LHC) at CERN has been designed to achieve the unprecedented luminosity of $10^{34} \rm{cm}^{-2} s^{-1}$. As a consequence, the silicon detectors close to the interaction region will receive severe doses of hadron irradiation. [...]
2004 - 15 p. - Published in : , pp. 129-143
In : 42nd INFN ELOISATRON Project Workshop : Innovative Detectors for Supercolliders "Ettore Majorana", Erice, Italy, 28 Sep - 4 Oct 2003, pp.129-143

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